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Diamond thickness reducing grinding wheel for silicon and sapphire wafer

Delivery term:The date of payment from buyers deliver within days
  • Price:

    Negotiable

  • minimum:

  • Total supply:

  • Delivery term:

    The date of payment from buyers deliver within days

  • seat:

    Beijing

  • Validity to:

    Long-term effective

  • Last update:

    2017-07-05 13:23

  • Browse the number:

    67

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Company Profile
Zibo Hans International Co. Ltd
By certification [File Integrity]
Contact:

xydiamond(Mr.)  

Telephone:

Area:

Beijing

Address:

313, 2nd Building, 145, Zhengtong Road, Zhangdian, Zibo, Shandong, China (255086)

Website: http://xydiamond.butterflyspraytanning.com/
Product details
Model Number: D255-#6838 Brand Name: XINYA Key Specifications/Special Features: Ceramicdiamond grinding wheel are special used for grindingSemiconductors material, such as silicone, sapphireSpecial diamond grinding wheel for semiconductors material have the highest sharpness and the best grinding effectThey are designed for grinding the surface of silicone waferand sapphire wafer.For reducing the thickness of thesiliconwaferand sapphire wafer.
Shipping Information:
  • FOB Port: Shanghai
  • Lead Time: 10 - 15 days
Main Export Markets:
  • Asia
  • Australasia
  • Central/South America
  • Eastern Europe
  • Mid East/Africa
  • North America
  • Western Europe
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